Chip assembly equipment - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

[Example of Problem Solving] Equipment Manufacturer

We will introduce examples of equipment development and low-temperature 80°C chip bonding to narrow-pitch PET substrates.

We would like to introduce a case study of our response to equipment manufacturers. When developing new process equipment, they faced challenges such as a lack of knowledge and development resources regarding the process, and the desire to sell the process and equipment as a package, but having processes that they do not own in-house. As a result, we conducted equipment development and low-temperature 80°C chip bonding for narrow-pitch PET substrates. [Case Overview] ■ Equipment Development - Equipment development tailored to specifications and budget requests. ■ Low-Temperature 80°C Chip Bonding for Narrow-Pitch PET Substrates - 27.5μm pitch wiring and bump formation (by Komori Corporation) - Low-temperature 80°C flip chip mounting *For more details, please refer to the PDF document or feel free to contact us.